電子部品検査用マシンビジョンレンズ：PCB、半導体、およびバッテリー用途
PCB AOI, wafer and die defect detection, and battery cell and pack inspection each put different demands on the lens.
Electronics, semiconductor, and battery inspection share one framework: define the smallest feature to detect, the field of view the station needs, and the working distance the fixture allows. Then match distortion, aperture, and image circle. Low distortion serves fiducial and placement geometry, and an adjustable iris handles varying component or cell height. A longer focal length solves stand-off clearance in battery packs, while telecentric optics apply only to dimensional metrology.
Commonlands covers these tasks with the CIL052 (5.2mm M12, low distortion) and CIL522 (12mm C-mount, adjustable iris), plus the longer and large-sensor options in the products section below.
One Selection Framework for Three Inspection Domains
All three reduce to the same inputs: the smallest feature to detect reliably, the field of view to cover, and the working distance the fixture allows. Focal length then follows from focal length = (working distance × sensor dimension) / field dimension, accurate when the working distance is much larger than the focal length. Lens category comes after those numbers, not before.
| ドメイン | 代表的なタスク | 一次光学ドライバ | レンズの向き（推定） |
|---|---|---|---|
| 電子機器／プリント基板 | フィデューシャルおよび部品配置のAOI | 全周にわたって低歪み | 5mm M12 または 6～12mm Cマウント |
| 電子機器／プリント基板 | はんだ接合部／コネクタの高さ | 被写界深度を調整できる絞り | アイリスリング付きCマウント |
| 半導体 | ウェハー表面／ダイの欠陥検出 | 解像度、コントラスト、適合イメージサークル | 16～35mm Cマウント、12～20MPセンサー |
| 半導体 | トレース幅／バンプ高さの計測 | 倍率の不変性 | テレセントリック（Commonlands社製品ではありません） |
| バッテリー | パウチ型セル／タブの位置合わせ | WDにおいて、低歪みでフラットなカバレッジを実現 | 5mm M12 または 12mm Cマウント |
| バッテリー | スタンドオフ・モジュール／パックの検査 | 安全距離から標的を射程内に収める | 50mm M12 または 25mm Cマウントの望遠レンズ |
Ground-sample distance (GSD), the size one pixel represents at the object plane, ties the three domains together. GSD equals field width divided by pixel count along that axis. See spatial resolution in machine vision for the full method.
Does PCB AOI Need a Low Distortion Lens?
Yes, for most PCB geometry and fiducial tasks. AOI registers a board to fiducial marks, then measures component placement against those references, and distortion displaces apparent feature position most at the field edges, where many components sit.
A lens with 1% radial distortion, referenced to maximum image height, displaces a corner feature by about 1% of the corner field radius. On a 60mm × 45mm field the half-diagonal is 37.5mm, so the corner error is roughly 0.4mm. An 0402 chip (1.0mm x 0.5mm) on 0.5mm-wide lands, whose IPC-A-610 side-overhang limit is near 0.125mm, is already outside budget at that shift. 0.5mm-pitch BGA is the least forgiving.
A lens at 0.3% TV distortion or lower is a common target for fine-pitch spacing, though the right figure depends on component pitch, field size, and the AOI system's own tolerance. The same requirement carries to code reading, since a barcode near a distorted corner has stretched elements that degrade decode confidence. See what is a low-distortion lens. Where the task is solder paste coverage or presence by silhouette, contrast matters more than geometry, and Commonlands publishes a distortion figure on every product page.
Why Does Solder Joint Inspection Put Pressure on Depth of Field?
A populated PCB is not flat. Tall connectors, through-hole components, and uneven solder volumes create height variation across the inspection area, often several millimeters on a dense board. Depth of field at a given aperture may not cover that range when focus is set to the board surface, leaving tall components or connector pins soft.
Stopping down deepens depth of field roughly linearly, about 2.9x between F/2.8 and F/8, at the cost of light, which scales with the square of that factor. LED illumination in an electronics station is typically programmatic, so trading light for depth of field is practical. That trade holds only up to the diffraction limit: the Airy disk is roughly 2.44 × wavelength × F-number, about 11μm at F/8. Past F/8, the depth gained starts costing resolution on a small-pixel sensor.
The iris ring on a Commonlands C-mount lens makes that trade available in the field. A fixed-aperture M12 lens does not, so its depth of field is engineered in through working distance and focal length. For bare boards or flat substrates the constraint never bites. Verify it with the depth-of-field calculator before committing to a fixed aperture on a board with tall components.
Choosing Between M12 and C-mount for Electronics Inspection
C-mount lenses are larger and heavier than M12; the payoff is an adjustable iris, a larger image circle, and consistent quality across a wider sensor area. A 20MP sensor on a 1.1-inch format only helps if the image circle covers it, and the Commonlands CIL544 25mm C-mount carries a 17.6mm image circle for exactly that.
When M12 Still Makes Sense
M12 is the right default when the head must fit a tight fixture and the sensor is 1/1.8 inch or smaller. Pick-and-place machines, label applicators, and inline conveyors often build the camera into the machine body, where C-mount diameter will not fit. The Commonlands CIL052 5.2mm M12 lens, at −0.1% distortion and covering up to 1/1.8-inch sensors, holds low distortion in a compact housing. Fixed aperture is fine for presence, polarity, or code reading on near-flat boards. A larger sensor or iris adjustment during production requires C-mount.
Choosing a Machine Vision Lens for Semiconductor Inspection
Semiconductor inspection covers wafer surface screening for particles and process defects, die inspection of bond pads and alignment marks, and package inspection of solder ball geometry or lead coplanarity. It starts from the same three inputs as electronics inspection, but feature sizes are typically an order of magnitude finer, which tightens the resolution and distortion budgets.
The task splits into two categories. Defect detection flags anomalies and does not need the image to represent physical dimensions, so distortion in the 0.3% to 0.5% range is usually tolerable because contrast and resolution drive detection. Dimensional metrology measures trace width, die placement, or bump height to a tolerance. That work needs distortion below 0.1%, and tight critical-dimension work needs it below 0.05%.
GSD sizes resolution here the same way it does for PCB work: keep it 2 to 3 times smaller than the minimum feature. The Commonlands CIL533 and CIL535 are specified at −0.1% distortion, within range for AOI and alignment and at the edge of tight metrology; the CIL545 tightens that to −0.07%. Using a longer lens from further back also narrows the viewing angles across the field, which can reduce position-dependent specular glare on reflective wafers and metallic packages.
Choosing a Machine Vision Lens for Battery Inspection
Battery inspection spans pouch cell and prismatic case surface inspection, cylindrical cell code reading, weld and seal verification at cell tabs, and stand-off inspection of modules and packs. The first three follow the electronics-inspection framework. The fourth introduces mechanical clearance that keeps the camera away from the target.
Flat Cell Surfaces and Code Reading
Pouch cells and prismatic cases are flat targets viewed roughly overhead, so the low-distortion logic from PCB fiducials applies: barrel distortion bows straight edges outward and shifts tab positions radially inward, and a lens at 0.5% or less keeps that geometry trustworthy without software correction. Data matrix and barcode marks carry the same requirement. Weld and seal inspection is the exception, caring about contrast at the weld zone more than geometry, since coaxial or structured illumination is the driving factor.
Why Stand-off Inspection Needs a Longer Focal Length
Battery module and pack assemblies have thermal components, structural members, and wiring that block close camera placement, often forcing the camera outside a 200mm to 500mm exclusion zone. A longer focal length reaches a narrow field of view from that distance without wide-angle distortion. The Commonlands 50mm M12 CIL051 (9° FoV, 0.1% TV distortion) is the telephoto pick for a connector or localized mark, where a 12mm lens at the same distance would cover far too wide a field.
When a Telecentric Lens Is Justified Across All Three Domains
Object-space telecentric lenses keep the chief ray close to parallel with the optical axis (the entrance pupil sits at infinity), so an object's apparent size stays effectively constant as its distance from the lens varies within the depth of field. That property matters only when a measurement depends on it. It does nothing for pass/fail detection.
Trace width, pad pitch, bump height, tab spacing, and lead coplanarity all need a pixel position to correspond to a known physical position regardless of small height variation. A standard entocentric lens introduces an apparent position error at the field edge whose significance depends on the measurement tolerance, and telecentric optics remove that sensitivity within their depth of field. That is the narrow class of measurement, across all three domains, where they earn their cost.
They are the wrong tool elsewhere. A telecentric lens needs a front element at least as large as the object field, so a lens covering a 50mm zone is at least 50mm across at the front, which constrains fixture design and costs far more than a comparable C-mount lens. PCB AOI, wafer and die defect detection, code reading, and weld inspection are pass/fail tasks a well-specified C-mount lens with sub-0.5% distortion handles without that penalty.
Commonlands does not currently offer telecentric lenses. For dimensional metrology that genuinely requires them, verify the object-field size and depth-of-field specification against the measurement tolerance before committing. See what is a telecentric lens for the underlying optics and lenses for quality inspection for the broader framework this pillar sits under.
Top Machine Vision Lenses for Electronics Inspection
These fixed-focal-length lenses cover the pass/fail and low-distortion measurement tiers for PCB, semiconductor, and battery inspection, ranked by task below. Each has published distortion and image circle figures. None has autofocus. This table is a set of examples, not the full catalog.
| 検査対象領域 | レンズ | マウント | EFL | この選手を選んだ理由 |
|---|---|---|---|---|
| PCBのフィデューシャルおよび配置のAOI | CIL052 | M12 | 5.2mm | −0.1%の歪み率により、視野全体でコンポーネントの位置を保持します。7.2mmのサークルで70°の視野角を実現し、設計上の9.0mmサークルは、コンパクトなヘッド内で最大1/1.8インチセンサーまでカバーします。 |
| はんだ接合部およびコネクタの検査 | CIL522 | Cマウント | 12mm | F/1.4 adjustable iris trades light for depth of field across board height variation; 51° FoV at an 11mm image circle for 2/3″ sensors. |
| ウェーハ表面＋基板のAOI | CIL533 | Cマウント | 16mm | 2/3インチ1200万画素センサー向けに、歪率−0.1％、像円径11mmを実現。表面欠陥検査に必要な解像度と均一性を備えています。 |
| ダイの検査＋位置合わせ | CIL535 / CIL545 | Cマウント | 35mm | Higher magnification at longer working distance; CIL535 holds −0.1% distortion on a 2/3″ 11mm circle (18° field), CIL545 tightens to −0.07% on a 1.1″ 17.6mm circle for the metrology edge. |
| 大型センサー搭載の20MP+検査 | CIL544 | Cマウント | 25mm | 17.6mmのイメージサークルは、1.1インチ・2000万画素以上のセンサーをカバーします。F/1.8の可変絞り、作動距離は130mm～∞です。 |
| バッテリーモジュール＋パックのスタンドオフ | CIL051 | M12 | 50mm | 9° FoV reaches the target across a 200–500mm clearance zone; 0.1% TV distortion at a 7.5mm reference circle. |
Telecentric lenses are third-party products rather than Commonlands SKUs.
よくある質問
マシンビジョンによる電子部品の検査には、どのようなレンズを使用すべきでしょうか？
Start with the task, not the lens family. PCB AOI and fiducial checks need low distortion, and solder and connector inspection needs an adjustable iris for depth of field. High-resolution stations need an image circle matched to the sensor. Commonlands picks include the CIL052 (5.2mm M12), CIL522 (12mm C-mount), and CIL544 (25mm C-mount, large-sensor).
ウェーハやダイの検査において、どの程度の歪みが許容範囲となるのでしょうか？
It depends on the task. Defect detection tolerates 0.3% to 0.5% distortion or more, since the goal is flagging anomalies. Dimensional metrology needs below 0.1%, and ideally below 0.05% for critical-dimension work. Commonlands C-mount lenses such as the CIL535 (−0.1%) and CIL545 (−0.07%) sit within range for most AOI and alignment tasks.
スタンドオフ方式のバッテリー検査では、なぜより長い焦点距離が必要なのでしょうか？
Battery module and pack assemblies have clearances, thermal management components, and structural members that keep the camera back. A longer focal length, typically 25mm to 50mm in M12 or C-mount format, reaches a narrow field of view from a greater working distance without wide-angle distortion. See machine vision lens for long working distance for the full guide.
PCB、半導体、またはバッテリーの検査には、テレセントリック光学系が必要ですか？
No, not for most tasks in any of the three domains. Telecentric lenses hold magnification nearly constant across height variation, which matters only for dimensional metrology: trace width, pad pitch, bump height, or tab spacing measured to a tight tolerance. PCB AOI, wafer and die defect detection, weld inspection, and code reading are pass/fail tasks. Commonlands does not currently offer telecentric lenses.
電子機器検査ステーションの焦点距離はどのように選べばよいですか？
Use focal length = (working distance × sensor dimension) / field dimension, accurate when the working distance is much larger than the focal length. At a 200mm working distance, a 7.2mm sensor width, and a 100mm wide field, that gives 14.4mm, so a 12mm lens fits with margin. Verify with the field-of-view calculator and EFL calculator.
Need Help Selecting a Lens for an Inspection Station?
Send your working distance, sensor format, and inspection task (PCB, wafer, die, or battery cell and pack) to the Commonlands engineering team. We will confirm distortion, iris, and image circle requirements and recommend the right optic. Commonlands lenses are MTF characterized, and orders placed before 12 PM PST ship the same day.